Crack-Tip Stress Analysis at a Bi-Material Interface by Photoelastic, Isopachic and FEA

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Stress Analysis at a Bi-Material Interface Crack-tip

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ژورنال

عنوان ژورنال: Materials Sciences and Applications

سال: 2011

ISSN: 2153-117X,2153-1188

DOI: 10.4236/msa.2011.28139